PART |
Description |
Maker |
MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
8SOIC |
8 PIN SOIC PACKAGE OUTLINE 8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|